Fr4 Multilayer Electronics Components PCB Assembly for video surveillance
Multilayer PCB Assembly Introduction
Multilayer PCB Assembly can save your money, have shorter lead time, and is of high-quality products. Our assemblers, preparing the PCB boards, procure raw materials & components, finishing quality testing & inspection, assembly it ready for delivery finally.
Our professional team are experienced in handling this delicate process, aiming to build multifunctional assemblies that serve all your purposes with space limitations to meet your needs.
Multilayer Circuit Board Assembly Capabilities
| FACTORY CAPABILITIES |
| No. | Items | 2020 |
| 1 | HDI Capabilities | HDI ELIC(5+2+5) |
| 2 | Max layer count | 46L |
| 3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
| 4 | Min.Hole Size | Laser 0.05mm |
| Mechnical 0.15 |
| 5 | Min Line Width/Space | 0.030mm/0.030mm |
| 6 | Copper Thickness | 1/3oz-6oz |
| 7 | Size Max Panel size | 700x610mm |
| 8 | Registration Accuracy | +/-0.05mm |
| 9 | Routing Accuracy | +/-0.05mm |
| 10 | Min.BGA PAD | 0.125mm |
| 11 | Max Aspect Ratio | 10:01 |
| 12 | Bow and Twist | 0.50% |
| 13 | Impedance Control Tolerance | +/-5% |
| 14 | Daily output | 4,000m2 (Max capacity of equipment) |
| 15 | Surface Finishing | HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD |
| 16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI |
| PCBA Capability |
| Material Type | Item | Min | Max |
| PCB | Dimension (length,width,height.mm) | 50*40*0.38 | 600*400*4.2 |
| Material | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC |
| Surface finish | HASL,OSP,Immersion gold,Flash Gold Finger |
| Components | Chip&IC | 1005 | 55mm |
| BGA Pitch | 0.3mm | - |
| QFP Pitch | 0.3mm | - |
SMT capabilities:
SMT Assembly: SMT provides a flexible high technology.
These solutions include:
7 high-speed placement machines, 7 automatic printers with fiducial alignment, 2 X-ray machines, BGA maintenance machines, ICT test machines
DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products with test stations
High temperature / low temperature aging test furnace B-4 for products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.
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Multilayer PCB Assembly Process
1.Solder Paste stenciling
2.Surface Mount Technology (Pick and Place)
3.Reflow Soldering
4.Inspection and Quality Control
5.Through-Hole Component Insertion (DIP Process)
6.Final Inspection and Functional Test
Our advantage
Service value
Independent quotation system to quickly serve the market
PCB manufacturing
High-tech PCB and PCB assembly production line
Material purchasing
A team of experienced electronic component procurement engineers
SMT post soldering
Dust-free workshop, high-end SMT patch processing
Delivery Time
| Product Type | Qty | Normal lead time | Quick-turn lead time |
| SMT+DIP | 1-50 | 1WD-2WD | 8H |
| SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
| SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
| SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
| PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
| PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
| PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
| PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
| PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
| PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
| PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
Workshop
Common packaging
PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box
Product Tags:
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16layer prototype fabrication Multilayer Pcb Assembly For Video Surveillance Images
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